GlobalFoundries and TSMC have agreed to a multi-year $2 billion deal to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced-packaging ecosystem. GF plans to add capacity at its Malta, New York site, with volume production expected to begin ramping in the first half of 2028. The initial term is five years, according to GF’s announcement.
The agreement concerns packaging capacity, not an accelerator launch. GF’s October 9 FDX Fusion announcement is a separate process-technology roadmap, covered in our report. Both items carry a 2028 horizon but involve different technologies and production plans.
